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内嵌散热片芯片——一种新的芯片散热方式,在众多厂商投入了大量的研发时间和经费之后终于诞生。本期“特别报道”,以对比以往散热方法的方式,剖析了内嵌散热片的奥秘。
Embedded heat sink chip - A new chip cooling method, many manufacturers have invested a lot of research and development time and funding was finally born. This issue of “Special Report” analyzes the mysteries of embedded heat sinks in a way that contrasts with previous cooling methods.