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目的探讨深圳市某五金电子加工厂的主要职业病危害因素,确定关键控制点,为企业职业病危害防护提供依据。方法采用现场职业卫生学调查、工作场所职业病危害因素检测等方法进行分析。结果该加工厂主要职业病危害因素为噪声、高温、粉尘、激光辐射、紫外辐射和化学毒物。各种职业病危害因素检测结果分别为工作场所噪声强度78.2~95.2 dB(A),超标率38.1%;个体噪声强度80.1~93.5 dB(A),超标率50.0%;矽尘浓度(总尘)(C_(TWA))6.6~6.9 mg/m~3,矽尘浓度(呼尘)(C_(TWA))1.6~1.8 mg/m~3,超标率100%;作业场所生产性热源的湿球黑球温度(WBGT)指数、激光辐射、紫外辐射、其他粉尘、砂轮磨尘、电焊烟尘和化学毒物强度(浓度)检测结果均低于职业接触限值。结论噪声、矽尘、化学毒物(甲醇、甲苯、正己烷)是该五金电子加工厂主要的控制因素,冲床、抛光喷砂、包装清洁、喷漆是关键控制工位。
Objective To explore the main occupational hazards of a hardware electronic processing factory in Shenzhen and to determine the key control points to provide the basis for the protection of occupational hazards in enterprises. Methods The methods of field occupational hygiene investigation and workplace occupational hazards detection were used to analyze. Results The main occupational hazards of the plant were noise, heat, dust, laser radiation, UV radiation and chemical poisons. The detection results of various occupational hazards were: workplace noise intensity 78.2-95.2 dB (A), exceeding the standard rate 38.1%; individual noise intensity 80.1-93.5 dB (A), exceeding the standard rate 50.0%; silica dust concentration (total dust) 6.6 ~ 6.9 mg / m 3 for C_ (TWA), 1.6 ~ 1.8 mg / m 3 for dust concentration (C_ (TWA)) and 100% The WBGT index, laser radiation, UV radiation, other dusts, grinding wheel dust, welding fumes and chemical poisons (concentration) test results were all below occupational exposure limits. Conclusion Noise, silica dust and chemical poisons (methanol, toluene and n-hexane) are the main control factors of this hardware electronic processing factory. Pressing, polishing and sand blasting, package cleaning and painting are the key control stations.