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针对COB形式的SiP模块,应用有限元分析方法模拟了该模块在湿热环境下的湿气扩散和湿应力分布,以及回流焊过程中的热应力分布,并通过吸湿实验和回流焊实验分析了该模块失效模式。结果表明,在湿热环境下,粘接材料夹在芯片和焊盘中间不易吸湿,造成粘接材料的相对湿度比塑封材料的相对湿度低得多。塑封材料相对湿度较高,产生较大的湿膨胀,使湿应力主要分布在塑封材料与芯片相接触的界面上。由于材料参数失配,回流焊过程产生的热应力主要分布在粘接材料和铜焊盘的界面,以及塑封料和铜焊盘的界面,在经过吸湿和回流焊实验后观察到界面分层沿着这些界面扩展。
According to the COB SiP module, the moisture diffusion and the wet stress distribution of the module in the hot and humid environment and the thermal stress distribution in the reflow process were simulated by the finite element analysis method. The moisture absorption and the reflow soldering experiments were used to analyze the effect of the module Module failure mode. The results show that in the hot and humid environment, the adhesive material sandwiched between the chip and the pad is not easy to absorb moisture, resulting in the relative humidity of the adhesive material is much lower than the relative humidity of the plastic material. Relatively high humidity plastic materials, resulting in greater wet expansion, the wet stress is mainly distributed in the plastic material in contact with the chip interface. Due to the mismatch of material parameters, the thermal stress generated during the reflow process is mainly distributed in the interface between the bonding material and the copper pad, and the interface between the plastic material and the copper pad. After the moisture absorption and reflow experiments, the interlaminar interface These interface extensions.