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目本东京技术研究院工程学院的研究人员研制出一种非电解铜涂覆陶瓷的新方法。这种方法使涂层与陶瓷板之间产生很高的粘结力。因此适宜制备高密度的印刷电路板。该种工艺方法为:用雾化方法在电路板上沉积一种氧化锌薄膜,然后在其上电镀一种没有腐蚀的高质量的铜膜。常规的工艺方法在预处理的过程中就有腐蚀现象产生,导致陶瓷板表面涂层不均匀,因此不适宜细丝的涂覆。新的工艺方法可以对几微米细的丝进行涂覆。但是,新方法限制电路板的宽度只为10μm,否则
Head Tokyo Institute of Technology Institute of Engineering researchers developed a new method of non-electrolytic copper coated ceramic. This method gives a high bond between the coating and the ceramic plate. Therefore, suitable for the preparation of high-density printed circuit board. The process is as follows: a zinc oxide film is deposited on the circuit board by an atomizing method, and then a non-corrosive high-quality copper film is plated thereon. Conventional process in the pretreatment process there is corrosion, resulting in uneven surface coating of ceramic plate, it is not suitable for filament coating. The new process can be fine wire coated a few microns. However, the new method limits the board width to only 10 μm, otherwise