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采用Sn-2·5Ag-2·0Ni焊料钎焊了具有Ni(P)/Ni(B)和Ni(P)/Ni两种双镀层结构的SiCp/Al复合材料.结果表明,SnAgNi/Ni(B)/Ni(P)和SnAgNi/Ni/Ni(P)两种接头均生成唯一的金属间化合物Ni3Sn4.SnAgNi焊料与Ni(B)镀层之间的快速反应速度使Ni3Sn4金属间化合物具有高的生长速度.时效初期的SnAgNi/Ni/Ni(P)接头的剪切强度高于SnAgNi/Ni(B)/Ni(P)接头,但在250h时效后其剪切强度剧烈下降,低于SnAgNi/Ni(B)/Ni(P)接头.金属间化合物的生长及裂纹的形成是SnAgNi/Ni/Ni(P)接头失效的主要原因,而SnAgNi/Ni(B)/Ni(P)接头失效的主要原因是Ni(P)镀层中Ni原子的定向扩散使SiCp/Al复合材料与Ni(P)处产生孔洞.
The SiCp / Al composites with Ni (P) / Ni (B) and Ni (P) / Ni two-layer structures were brazed with Sn-2 · 5Ag-2 · 0Ni solder.The results show that SnAgNi / The rapid reaction between Sn / Ni (P) and SnAgNi / Ni / Ni (P) both produce the only intermetallic compound Ni3Sn4.SnAgNi solder and Ni (B) coating make the Ni3Sn4 intermetallic compound have high The shear strength of SnAgNi / Ni / Ni (P) joints at the early aging was higher than that of SnAgNi / Ni (B) / Ni (P) joints, but their shear strength decreased sharply after aging at 250h, Ni (B) / Ni (P) joints.The growth of intermetallic compounds and the formation of cracks are the main reasons for the failure of SnAgNi / Ni / Ni (P) joints, whereas the failure of SnAgNi / Ni The main reason is that directional diffusion of Ni atoms in the Ni (P) coating causes voids in the SiCp / Al composite and Ni (P).