半导体硅片的抛光是半导体器件生产中的一道重要工序.二氧化硅无纺布衬垫抛光是替代铬离子长毛绒抛光的有效途径,其优点是:抛光片表面损伤小、平整度好,消除了六价铬对人体的危害.国外早在六十年代就开始采用二氧化硅抛光,在这方面积累了大量经验.而国内则是在七十年代后期才开始这方面工作,因此经验较缺乏.但是二氧化硅抛光的优越性已在器件生产中充分体现出来了. Polishing of semiconductor wafers is an important process in the manufacture of semiconductor devices. Silica non-woven pad polishing is an effective alternative to polish of plush chromium ions, which has the advantages of low surface damage and good flatness, Hexavalent chromium harm to the human body abroad as early as the 1960s began to use silica polishing, accumulated a lot of experience in this regard while the domestic is in the late seventies began this work, so the experience is lacking. However, the superiority of silica polishing has been fully demonstrated in the device production.