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锡圈是半导体晶体管中作結合用的零件,由0.02毫米厚的錫带冲制而成(見下頁图1的工件图),要求四周无毛刺,表面光滑平整。我厂过去用复合模冲制,但由于鍚带薄而軟,工件尺寸又很小,冲后往往粘附在凸模或彈頂圈上,不易取下,有时即使取下,亦已变形,不能使用,損坏率通常在70%以上,而且冲制时用手送料,稍不留心,整根錫带就因变形而报廢。此外,复合模彈頂圈与凸凹模之間有一定間隙,冲制时錫經常嵌入間隙中,阻碍了彈頂圈的运动,以致拆修頻繁。
The tin ring is a part for bonding in a semiconductor transistor. It is made of 0.02 mm thick tin plate (see the workpiece diagram in Figure 1 on the next page). It requires no burr around and the surface is smooth and flat. I plant in the past with a composite die Chong, but due to the thin belt with a soft, small size of the workpiece, after the punch is often attached to the punch or top ring, not easy to remove, and sometimes even removed, has been deformed, Can not be used, the damage rate is usually more than 70%, and when the punch used to hand feeding, a little careless, the whole root tin due to deformation and scrapped. In addition, there is a certain gap between the top die and the punch and die of the compound die shell, and the tin is often embedded in the gap during the punching process, which hinders the movement of the top ring so that the overhaul is frequent.