用惰性气体蒸发法和电弧等离子体法制备了纳米铜粒子,以此作为导热填料,研制出了具有高导热系数的新型纳米铜导热硅脂。在LGA 775和Socket 939计算机平台上进行了试验,结果表明,新型硅脂能大大降低CPU的工作温度,并对此进行了机理分析。 Nanocrystalline copper particles were prepared by inert gas evaporation method and arc plasma method. As a thermal conductive filler, a novel nano-Cu thermal grease with high thermal conductivity was developed. Experiments were carried out on LGA 775 and Socket 939 computer platforms. The results show that the new type of grease can greatly reduce the operating temperature of the CPU and analyze the mechanism.