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研究了以TEA和EDTA为络合剂、多聚甲醛为还原剂、二硫基苯并噻唑为稳定剂、凝胶和动物胶为添加剂的镀铜化学沉积过程。化学镀铜溶液的稳定性可通过紫外可见分光光度仪测量溶液的吸光度来监测,在15 h内溶液都相当稳定。采用标准弯曲试验评估在低碳钢箔上铜膜的附着力,显示了很好的吸附性。XRD结果表明,铜膜具有(111)织构,而且,添加剂能够抑制(111)面的优先晶体生长,提高(220)织构的晶体生长速度。利用Scherrer公式从主峰计算铜膜的晶粒尺寸。SEM和AFM研究表明,这两种添加剂能够改善铜膜的晶体结构、晶粒尺寸和表面形貌。循环伏安法研究表明,添加剂能够被吸附在电极表面并降低沉积速率。动电位极化和电化学阻抗研究表明,有添加剂时产生的沉淀具有更高的耐腐蚀性。
The electroless copper plating process was studied using TEA and EDTA as complexing agents, paraformaldehyde as reducing agent, dithiobenzothiazole as stabilizer, gel and animal glue as additives. The stability of the electroless copper plating solution can be monitored by measuring the absorbance of the solution with a UV-visible spectrophotometer. The solution is fairly stable within 15 h. The standard bending test was used to assess the adhesion of the copper film on the mild steel foil, showing good adsorbability. XRD results show that the copper film has a (111) texture, and the additive can suppress the preferential crystal growth of the (111) plane and increase the (220) texture crystal growth rate. Calculate the grain size of the copper film from the main peak using the Scherrer formula. SEM and AFM studies show that these two additives can improve the crystal structure of copper film, grain size and surface morphology. Cyclic voltammetry studies have shown that additives can be adsorbed on the electrode surface and reduce the deposition rate. Potentiodynamic and electrochemical impedance studies have shown that precipitates produced with additives have higher corrosion resistance.