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使用光电化学与电化学石英晶体微天平联用（PECQCM）技术对中性介质铜缓蚀剂成膜过程进行了现场研究．结果表明，在中性Na2SO4溶液中钝化型缓蚀剂Na2OrO4对Cu成膜生长有抛物线规律，而由于Cl-的影响，在中性NaCl溶液中，该缓蚀剂膜生长曲线为折线型．沉淀型缓蚀剂Na2SiO3在Na2SO4溶液中的铜晶振电极上不成膜，而在NaCl溶液中可成膜．
A field study of the film formation of a neutral copper inhibitor was carried out using the photoelectrochemical and electrochemical quartz crystal microbalance (PECQCM) technique. The results show that the passivation inhibitor Na2OrO4 has a parabolic law in the neutral Na 2 SO 4 solution. However, due to the effect of Cl-, the growth curve of the corrosion inhibitor is linear in NaCl solution. Precipitation type corrosion inhibitor Na2SiO3 does not form a film on the copper crystal electrode in Na2SO4 solution, but can form a film in the NaCl solution.