论文部分内容阅读
通过化学镀法制备铜包钨复合粉末,研究不规则形状的钨粉以及经等离子球化处理的球形钨粉的化学镀铜。结果表明,对于颗粒形貌不规则棱角分明的破碎钨粉,经化学镀包覆后粉末没有明显的棱角,表面粗糙。而经等离子球化处理后球形度较高的球形粉,颗粒表面存在缺陷,化学镀后粉末的球形度没有明显的变化,化学镀层在其表面沉积均匀,且钨粉表面质量得到改善,不存在表面缺陷。化学镀后复合粉末在600℃下进行氢气退火处理后,镀层上的粗糙的表面变得平滑,镀层中的空隙明显减少,形成了一层均匀致密的铜层包覆在钨颗粒表面。
Copper clad tungsten composite powders were prepared by electroless plating, and the electroless copper plating of irregular shaped tungsten powders and spherical spheroidal tungsten powders was studied. The results show that the irregular shape of the particles with irregular angular Crushed tungsten powder coated by electroless plating has no obvious edges and rough surface. However, the spherical particles with high sphericity after plasma-spheroidization have defects on the surface of the particles. The sphericity of the particles after electroless plating has no obvious change. The electroless plating layer is uniformly deposited on the surface and the surface quality of the tungsten powder is improved and does not exist Surface defects. After annealing of hydrogen at 600 ℃, the rough surface of the coating becomes smooth and the voids in the coating are obviously reduced. A uniform and dense copper layer is formed on the surface of the tungsten particles.