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设计并试制了一种新型垂直耦合光互连线路结构,可用于高速计算机内部等垂直堆叠的多层连通光互连的芯片间光信息通讯。其结构简单,且具有较小的连接损耗(可低至0.05dB)。对四种不同的典型波导截面(分别为30μm×30μm,50μm×50μm,100μm×100μm,200μm×200μm),利用蒙特卡罗多光线追迹分析法对跨越1~6层的垂直耦合结构进行了性能分析,发现当该结构的跨越高度与横向跨越距离的比值约为0.128时,可实现较理想的低损耗(低于1dB)光传输。采用软光刻的方法制备了实验多层光互连线路,其性能测试与理论结果基本相符。
A new type of vertical coupling optical interconnection circuit is designed and fabricated. It can be used for optical information communication between chips in multi-layer interconnected optical interconnects such as vertically stacked in high-speed computer. Its structure is simple, and has a small connection loss (down to 0.05dB). Four different typical waveguide cross sections (30μm × 30μm, 50μm × 50μm, 100μm × 100μm, 200μm × 200μm, respectively) were used to analyze the vertical coupling structures spanning 1 ~ 6 layers by Monte Carlo multi ray tracing analysis Performance analysis shows that when the ratio between the span height and the horizontal span of the structure is about 0.128, it is found that the ideal low loss (less than 1dB) optical transmission can be achieved. The experimental multilayer optical interconnection was fabricated by soft lithography, and its performance test was in good agreement with the theoretical results.