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在三维系统封装技术中,金属热压键合是实现多层芯片堆叠和垂直互连的关键技术。为了解决热压键合产生的高温带来的不利影响,工业界和各大科研机构相继开发出了多种低温键合技术。综述了多种不同的低温金属键合技术(主要是Cu-Cu键合),重点阐述了国内外低温金属键合技术的最新研究进展及成果,并对不同低温金属键合技术的优缺点进行了分析和比较。
In three-dimensional system packaging technology, metal thermocompression bonding is the key technology for multi-layer chip stacking and vertical interconnection. In order to solve the adverse effect of hot bonding caused by high temperature, industrial and major research institutions have developed a variety of low temperature bonding technology. Many different low-temperature metal bonding technologies (mainly Cu-Cu bonding) are reviewed. The recent research progress and achievements of low-temperature metal bonding technology at home and abroad are reviewed. The advantages and disadvantages of different low-temperature metal bonding technologies Analysis and comparison.