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本文研究了Al—Cu 合金在定向凝固条件下的固液界面形态。对于每一固定成分,存在一个临界的G/R 值(?)(?)(mc_0(1-k_0))/(D·k_0)(?),当低于此临界值时平面界面将破坏,且随G/R 值下降出现从平面—洼坑—不规则胞状—长条形胞状—六角形胞状的过渡。本研究工作采用Y 调制法测试技术证实洼坑界面是成分过冷刚刚形成时的界面形态特征,并揭示了平面界面如何过渡到胞状界面的规律。即通过洼坑—发展成沟槽—分割平面—在溶质横向扩散作用下形成凸出面的胞状晶。
In this paper, the solid-liquid interface morphology of Al-Cu alloy under directional solidification conditions is studied. There is a critical G / R value (?) (?) (Mc_0 (1-k_0)) / (Dk_0) (?) For each stationary component below which the planar interface will be destroyed, And with the G / R value decreased from the plane - depression - irregular cell - long cell-shaped hexagonal cell transition. In this work, Y modulation method was used to confirm the interface morphology of the dipping interface when the component was undercooling, and the regularity of how the planar interface transitioned to the cellular interface was revealed. That is, through the diagenesis - into a trench - the plane of division - in the solute lateral diffusion under the formation of convex surface of the cell crystal.