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采用输出功率10 W的355 nm紫外激光器对4层柔性线路板(FPC)进行了盲孔加工实验。分析了紫外激光与铜箔和聚酰亚胺(PI)相互作用的过程和机理,并模拟出在一定条件下紫外激光与聚酰亚胺和铜箔相互作用时的单脉冲刻蚀深度。研究了不同加工方式对加工质量的影响,得到优化工艺参数为:第一次采用加工功率3.9 W,频率80 kHz,第二次将加工功率降到1.4 W,其他参数不变,此时加工盲孔的效果最为理想,重铸层粗糙度为0.88966μm,孔底粗糙度为1.063μm。给出了孔底表面的扫描电镜(SEM)图和针式台阶仪测量的盲孔底面三维轮廓及切面二维轮廓图。
A 4-layer flexible circuit board (FPC) was blind-hole machined using a 355 nm UV laser with 10 W output power. The process and mechanism of UV laser interaction with copper foil and polyimide (PI) were analyzed. The single-pulse etching depth of UV laser with polyimide and copper foil under certain conditions was simulated. The effects of different processing methods on the processing quality were studied. The optimized processing parameters were as follows: the first processing power was 3.9 W, the frequency was 80 kHz, the second processing power was reduced to 1.4 W, the other parameters were unchanged, and the processing was blind The most effective hole, recast layer roughness of 0.88966μm, hole bottom roughness of 1.063μm. The scanning electron microscope (SEM) chart of the bottom of the hole and the three-dimensional outline of the bottom of the blind hole and the two-dimensional profile of the section measured by the stylus stepmeter are given.