集成电路的焊接工艺其实分为两方面,一是电路芯片焊接,另外一个就是电路引线,由此可见,集成电路的引线焊接是电路芯片焊接完成后的一道焊接工序,所谓的引线焊接是指把电路芯片上已金属化的电路引出端或电极,与装配芯片的金属引线框架或外壳引出电极线一一对应连接起来的焊接工艺,本文针对对集成电路的引线焊接的检测进行简单的说明。 In fact, integrated circuit welding process is divided into two aspects, one is the circuit chip welding, the other is the circuit leads, we can see that the integrated circuit is the lead wire soldering after the completion of the circuit chip welding process, the so-called lead soldering refers to the The metallized circuit leads or electrodes on the circuit chip are connected with the metal lead frame or the shell lead-out electrode line of the assembly chip in a one-to-one correspondence. This article will briefly describe the testing of the lead wire bonding of the integrated circuit.