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位于美国加州的功率半导体和集成电路的供应商IXYS公司日前宣布一项新型的铝基基片技术。该项技术也称为直接铝材连接(direct aluminum bonded简称(DAB)技术,已经用于集成功率半导体模块的生产中,例如:马达驱动、DC/DC转换器和功率模块中。该项技术是一项替换直接铜材连接(direct copper bonded)简称(DCB)先进技术,在直接铜材连接技术中铜作为主要的导体被连接到铝或者氮化铝陶瓷上。
IXYS, a supplier of power semiconductors and integrated circuits in California, USA, today announced a new aluminum substrate technology. This technology, also known as direct aluminum bonded abbreviation (DAB) technology, has been used in the production of integrated power semiconductor modules such as motor drives, DC / DC converters and power modules. The technology is An advanced technology that replaces the direct copper bonded abbreviation (DCB), in which copper is connected as the main conductor to aluminum or aluminum nitride ceramic in direct copper connection technology.