系统芯片(SoC)旨在采用单一的半导体工艺技术实现完整的系统。系统封装(SiP)则是将各种不同的工艺技术整合到一个小型的芯片封装中。尽管SoC和SiP通常被认为是相互竞争的技术,但两者的共同之处在于:在集成密度、价位和大规模制造方面要和晶圆生产达到平衡点。除了双极晶体管、M System on Chip (SoC) is designed to achieve a complete system using a single semiconductor process technology. System Packaging (SiP) is the integration of various process technologies into a small chip package. While SoCs and SiPs are often considered competing technologies, the two have in common the fact that they are in balance with wafer production in terms of integrated density, price point, and mass production. In addition to bipolar transistors, M