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采用球磨法与热压烧结工艺制备了添加w(n-SiO2)=1.0%的铜基纳米复合材料。通过球盘式摩擦磨损试验机测试了复合材料的摩擦磨损性能,采用排水法和场发射扫描电镜(FSEM)研究了复合材料的致密度、显微组织和磨损形貌。结果表明:球磨可提高复合材料的致密度,改善n-SiO2在铜基体中的分散均匀性;随球磨时间的增加,复合材料的动摩擦因数和磨损量先减小后增加,球磨10 h复合材料具有较低的摩擦因数和磨损量,磨损机理主要为磨料磨损。
Addition of w (n-SiO2) = 1.0% copper-based nanocomposites by ball milling and hot pressing process. The friction and wear properties of the composites were tested by a ball-and-disc friction and wear tester. The densification, microstructure and wear morphology of the composites were studied by using drainage and field emission scanning electron microscopy (FSEM). The results show that ball milling can improve the density of composite and improve the uniformity of n-SiO2 dispersion in copper matrix. With the increase of ball milling time, the dynamic friction coefficient and wear volume of composite decrease first and then increase, Has a lower friction coefficient and wear, abrasion mechanism is mainly abrasive wear.