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这个工具不用实际接触片子的边缘,而使半导体片子的位置和方向精确对准。在半导体生产工艺中它可用于光刻之前的片子对准,从而减少人工装卸。图1所示为一包含空气传送带支撑板10在内的该装置之局部示意图。三个二元
This tool does not actually touch the edges of the film, but precisely positions the position and orientation of the semiconductor film. It can be used for wafer alignment prior to lithography in semiconductor manufacturing processes, reducing manual handling. FIG. 1 shows a partial view of the device including the air conveyor support plate 10. Three two yuan