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以聚苯乙烯微球(PS)为模板,采用“种子-生长”法在聚苯乙烯微球表面直接镀覆具有自支撑性的金壳层,成形热处理去除PS模板,成功制备出空心微球结构圆柱形块体的泡沫金样品,并对其制备工艺进行了研究。研究表明:平均晶粒尺寸为4.6nm的金纳米粒子通过静电作用可成功粘附于交联聚苯乙烯微球(PS-DVB)表面。化学镀时以粘附的金纳米粒子为种子继续生长,沉积的金颗粒细小而致密,粒径主要分布于30～60nm,且微球表面金沉积层的包覆率高,包覆厚度70～90nm,PS模板去除后金沉积层具有良好的自支撑性。采用类似粉浆铸造工艺使gold/PS有孔隙地随机堆积成型,热处理去除聚苯乙烯模板后可成功获得圆柱体形状的泡沫金样品。制备的泡沫金由直径8～9μm的空心球壳组成,圆柱体直径约4mm,密度约1.5g/cm3,孔隙率高达92%。
Polystyrene microspheres (PS) were used as templates to directly coat the surface of polystyrene microspheres with a self-supporting gold shell by the “seed-growth” method. The PS template was removed by heat treatment to form a hollow The microstructure of the microspheres is the foamy gold sample of the cylindrical block, and its preparation process is studied. The results show that Au nanoparticles with an average grain size of 4.6 nm can be successfully adhered to the surface of crosslinked polystyrene microspheres (PS-DVB) through electrostatic interaction. When electroless plating, the adhered gold nanoparticles continue to grow as seeds, the deposited gold particles are small and dense, the particle size is mainly distributed in the range of 30-60 nm, the coverage of the gold layer on the surface of the microsphere is high, 90nm, PS template removal gold deposition layer has a good self-supporting. A slurry-like casting process was used to deposit gold / PS randomly with pores. After the polystyrene template was removed by heat treatment, a foamy gold cylinder sample was successfully obtained. The prepared foam gold is composed of a hollow spherical shell with a diameter of 8 to 9 μm, the diameter of the cylinder is about 4 mm, the density is about 1.5 g / cm 3, and the porosity is up to 92%.