在1998年度内进行的封装和电源的开发工作,充分反映了产业界对于缩小电子产品体积,提高电子产品性能和增加其功率处理能力的迫切追求。为了跟上半导体器件在多引出端和高性能方面的最新进展,封装供应厂商开始提供了好几种新的封装;这些封装不但可以提高线路板的安装密度,而且在价格方面相对于老的封装也具有竟争能力。另外在电源方面,新型的电池和电源设备在性能、功率密 The packaging and power development conducted in 1998 fully reflected the urgent need of the industry to reduce the size of electronic products, improve the performance of electronic products and increase their power handling capabilities. In keeping with the recent advances in multi-terminal and high performance semiconductor devices, package suppliers have come up with several new packages that not only increase board mounting density but also price relative to older packages Also has the ability to compete. In addition, the power supply, the new battery and power equipment performance, power density