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针对铝合金传统阳极氧化膜耐温性差的问题,首次研究了一步阳极氧化技术制备铝合金有机/无机复合膜,并利用SEM、EDS、显微硬度计、耐压仪等对阳极氧化复合膜的结构及性能进行表征。结果表明:6061铝合金表面形成的是一种棒状堆砌的多层状有机/无机阳极氧化复合膜,击穿电压和硬度分别为1400V和2820MPa(HV),略低于传统阳极氧化膜击穿电压(1600V)和硬度(3940MPa),复合膜的耐温性能远远优于传统阳极氧化膜,是一种既具有良好耐温性能又具有较高的击穿电压和硬度的绝缘膜,可望作为大功率集成电路的散热基板。
Aiming at the poor temperature resistance of traditional anodic oxide film of aluminum alloy, the one-step anodic oxidation technology was used to prepare aluminum alloy organic / inorganic composite film. SEM, EDS, microhardness tester, Structure and performance of the characterization. The results show that the multilayer composite organic / inorganic anodic oxidation film with a breakdown voltage and hardness of 1400V and 2820MPa (HV) is formed on the surface of 6061 aluminum alloy, which is slightly lower than the breakdown voltage of the traditional anodic oxide film (1600V) and hardness (3940MPa), the composite film is far superior to traditional anodic oxide film in temperature resistance, which is an insulating film with good temperature resistance and high breakdown voltage and hardness. It is expected that High-power integrated circuit cooling substrate.