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研究了微量合金元素Ag、P对Cu-Ni-Si合金组织和性能的影响。结果表明:微量的合金元素Ag、P的加入使Cu-Ni-Si合金出现严重的晶格畸变,起到了有效的细化晶粒的作用,同时能有效地提高Cu-Ni-Si合金的抗拉强度、电导率以及显微硬度。在450℃时效2 h,加入0.15%Ag使其导电率提高15.3%;加入0.03%P使其显微硬度和抗拉强度分别提高18.6%和29.8%。同时Cu-Ni-Si合金中加入微量合金元素Ag、P能明显地抑制Cu-Ni-Si合金的再结晶过程,并能细化该合金的再结晶晶粒。
The effect of trace alloying element Ag, P on the microstructure and properties of Cu-Ni-Si alloy was studied. The results show that adding a small amount of alloying elements Ag, P causes serious lattice distortion in the Cu-Ni-Si alloy, which can effectively refine grains and improve the resistance of the Cu-Ni-Si alloy Tensile strength, electrical conductivity and microhardness. After aging at 450 ℃ for 2 h, 0.15% Ag was added to increase the conductivity by 15.3%. Adding 0.03% P increased the microhardness and tensile strength by 18.6% and 29.8% respectively. At the same time, addition of trace alloying element Ag, P in Cu-Ni-Si alloy can obviously restrain the recrystallization process of Cu-Ni-Si alloy and refine the recrystallized grains of the alloy.