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在晶圆边缘芯片上的系统性工艺缺陷进入到晶圆内部芯片之前,如果发现并解决这些缺陷问题,可以防止产品成品率损失并加快成品率的提升速度。
Systematic process defects on wafer-edge chips before they enter the wafer’s internal die prevent these product yield losses and accelerate the rate of yield improvements if they are identified and addressed.