引言随着移动消费型电子产品对于小型化、功能集成以及大存储空间的要求的进一步提升,元器件的小型化高密度封装形式也越来越多,如多模块封装(MCM)、系统封装(SiP)、倒装芯片等应用得越来越多。而元件堆叠装配(PoP,Package on Package)技术的出现更加模糊了一级封装与二级装配之间的界线．在大大提高逻辑运算功能和存储空间的同时,也为终端用户提供了自由选择器件组合的可能,生产成本也得以更有效的控制。对于3G手机PoP无疑是一个值得考虑的优选方案。 Introduction With the further improvement of miniaturization, functional integration and large storage space requirements of mobile consumer electronic products, miniaturization and high density packaging of components and parts are also increasing, such as multi-module package (MCM), system package SiP), flip-chip applications more and more. The emergence of PoP (Package on Package) technology has blurred the boundary between first-level packaging and second-level assembly. While greatly improving the logic operation function and storage space, it also provides the end user with the possibility of freely selecting the device combination, and the production cost can be more effectively controlled. PoP for 3G handsets is undoubtedly a worth considering solution.