据《NIKKEI MICRODEVICES》2007年第6期报道,美国Ziptronix公司和美国Raytheon Vision Systems(RVS)公司合作研发了5层CMOS器件和光电二极管进行3维叠层的封装技术。Ziptronix公司将其称为DBI(Direct Bond In-terconnect)。DBI技术无论是芯片与圆片,还是圆片与圆片在室温下都可 According to “NIKKEI MICRODEVICES” 2007 the sixth period reported that the United States and the United States Ziptronix company Raytheon Vision Systems (RVS) company developed five layers of CMOS devices and photodiodes for three-dimensional laminated packaging technology. Ziptronix calls it DBI (Direct Bond In-terconnect). DBI technology, whether chips and wafers, or wafers and wafers at room temperature can be