半导体集成电路的大容量和高密度化异常惊人,以存储器为例,1M位的DRAM已经批量生产,而4M位的DRAM也有试制品发表。光刻技术是这些产品图形微细加工的关键之一。生产高密度器件要有高的成品率,就要提高膜和线宽的均匀性及无尘化等,所以要求改进光刻胶处理装置。在此介绍光刻胶处理装置近况并叙述今后发展的有关动向。 Large-capacity and high-density semiconductor integrated circuits exceptionally alarming, to memory, for example, 1M-bit DRAM has been mass-produced, and 4M-bit DRAM also trial products published. Lithography is one of the keys to microfabrication of these products. The production of high-density devices to have a high yield, it is necessary to improve the uniformity of the film and line width and dust-free, and so require improved photoresist processing device. This article introduces the status of photoresist processing equipment and describes the relevant developments in the future.