三菱电机、松下电器工业、松下电子工业等三家公司开发出了用于携带图像装置的超高集成、低功耗混装ＤＲＡＭ核。从 1998年 12月开始 ,在有效运用ＤＲＡＭ混装技术和高速逻辑技术的基础上 ,三家公司对第 2代系统ＬＳＩ技术进行了共同开发。在开发产品中 ,实现了世界上最小尺寸 Mitsubishi, Matsushita Electric Industrial, and Matsushita Electric Industrial have developed highly integrated, low-power hybrid DRAM cores for carrying image devices. From December 1998 onwards, based on the effective use of DRAM hybrid technology and high-speed logic technology, the three companies jointly developed the 2nd generation system LSI technology. In developing products, the world’s smallest size has been achieved