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互连温升越高,引起的互连温度效应越明显.通孔具有相对较高的热导率,可以成为有效的热传导途径,极大地降低互连平均温升.针对通孔这一特性引入虚拟通孔,建立考虑多虚拟通孔效应的互连平均温升模型.所提模型将多通孔效应整合到层间介质的有效热导率中得到更为精确的结果.此外根据不同的层间介质材料对多通孔效应进行分析讨论,并对多通孔效应进行扩展应用,得出使互连平均温升最小时的通孔间距与通孔数量.所提模型应用到集成电路设计中可以提高电路设计的精确度,优化电路性能.
The higher the temperature rise of interconnection, the more obvious the effect of interconnection temperature is caused.The via hole has a relatively high thermal conductivity, which can be an effective heat conduction way and greatly reduce the average temperature rise of interconnection. Virtual vias to establish an interconnection average temperature rise model that takes into account the effect of multiple virtual vias.The proposed model achieves more accurate results by integrating the multi-vias into the effective thermal conductivity of the interlayer dielectric.In addition, Between the dielectric material on the multi-hole effect analysis and discussion, and multi-hole effect extended application, the average interconnect temperature reached when the minimum inter-hole pitch and the number of through-hole. The proposed model is applied to the design of integrated circuits Can improve the circuit design accuracy, optimize circuit performance.