日本超导工学研究所和 NEC等 3公司共同开发成功高温超导元件加工新技术 ,解决了过去由“约翰夫森接合”难度高造成的性能不均问题。研究组正进一步研究改进 ,以便尽快实用化。“约翰夫森接合”指在 2种超导薄膜间夹有 10 μm的极薄绝缘层的结构。长期由于制造技术太难 ,致使影 Japan Institute of Superconductivity and NEC, etc. 3 companies to jointly develop successful processing of high temperature superconducting components of new technologies to solve the past by the “John F. Fujinaga” difficult to create high performance problems caused by uneven. The research group is further studying the improvement so as to be practical as soon as possible. “John Fson bonding” refers to a structure in which an extremely thin insulating layer of 10 μm is interposed between two types of superconducting thin films. Long-term because of manufacturing technology is too difficult, resulting in film