采用有机化合物和金属氧化物，按比例均匀混合制成液状ＳＭ材料，涂敷于器件台表面上，经过高温固化，形成坚硬、高密度、不透气的白色固体绝缘保护层。该保护材料经电性能检测和在Ｋｐ５００Ａ晶闸管生产线工艺论证，各项技术指标均符合器件制造要求。用于器件生产能明显地改善表面特性、减少漏电流和提高耐压水平，并使产品合格率有大幅度提高。 The organic compound and the metal oxide are uniformly mixed in proportion to form a liquid SM material, which is coated on the surface of the device stage and solidified at a high temperature to form a hard, high-density, air-impermeable white solid insulating protective layer. The protective material by the electrical performance testing and process demonstration Kp500A thyristor production line, the technical indicators are in line with the device manufacturing requirements. For device production can significantly improve the surface properties, reduce leakage current and improve the level of voltage, and product yield has greatly improved.