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电子系统微型化、大功率的发展趋势,以及对系统性能和可靠性的需求,要求电子元件具有更为强大的散热性能.空气射流冲击,尤其与其他表面强化传热方式的结合是一个很好的选择,采用这种散热方式几乎能达到与液体冷却相当的散热能力.选用3个不同肋高的矩形柱鳍热沉对空气射流冲击矩形柱鳍热沉进行传热特性的实验研究.首先,分别获得了这3个热沉的热阻(θab)随Re数及H/D变化的实验数据和对应这3个热沉的模拟芯片表面的平均努塞尔数(Nu)随Re数及H/D变化的实验数据;其次,选用合适的函数形式对实验数据采用最小二乘法拟合,得到了此实验条件下关于Re、H/D及肋片高度Hf的准数方程.实验结果表明,随Re或H/D的增大而减小,但当Re或H/D增大到一定程度时,θab减小的幅度就不再明显;Nu数关于Re、H/D及肋片高度Hf的实验公式,其相对误差小于9%;在3159≤Re≤15798的范围内,这种冷却方式下的对流换热系数可达500～1100W/(m·2K).
The miniaturization of electronic systems, the trend of high power development, and the demand for system performance and reliability require more powerful heat dissipation of electronic components.Air jet impact, especially combined with other surface enhanced heat transfer methods, is a good one , This method can achieve almost the same heat dissipation capacity as liquid cooling.An experiment on the heat transfer characteristics of rectangular columnar fin heat sink with three different ribbed rectangular fin heat sinks is carried out.Firstly, The experimental data of the thermal resistance (θab) of the three heat sinks with the Re number and the H / D variation are obtained respectively. The average Nusselt number (Nu) of the simulated chip surface corresponding to the three heat sinks is calculated with Re number and H / D variation of the experimental data; Secondly, using the appropriate function form of the experimental data using least-squares fitting, obtained under this experimental conditions Re, H / D and fin height Hf quasi-number equation.The experimental results show that, With Re or H / D increases and decreases, but when Re or H / D increases to a certain extent, θab decreases the magnitude of no significant; Nu number on the Re, H / D and fin height Hf Of the experimental formula, the relative error is less than 9%; in the range of 3159 ≤ Re ≤ 15798, This cooling mode convection heat transfer coefficient of up to 500 ~ 1100W / (m · 2K).