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采用实验方法 ,确定了倒装焊 Sn Pb焊点的热循环寿命 .采用粘塑性和粘弹性材料模式描述了 Sn Pb焊料和底充胶的力学行为 ,用有限元方法模拟了 Sn Pb焊点在热循环条件下的应力应变过程 .基于计算的塑性应变范围和实验的热循环寿命 ,确定了倒装焊 Sn Pb焊点热循环失效 Coffin- Manson经验方程的材料参数 .研究表明 ,有底充胶倒装焊 Sn Pb焊点的塑性应变范围比无底充胶时明显减小 ,热循环寿命可提高约 2 0倍 ,充胶后的焊点高度对可靠性的影响变得不明显
The thermal cycle life of flip-chip Sn-Pb solder joints was determined by the experimental method.The mechanical behavior of Sn-Pb solder and underfill materials was described by using viscoplastic and viscoelastic material models. The influence of Sn-Pb solder joints on Based on the calculated plastic strain range and the experimental thermal cycle life, the material parameters of the Coffin-Manson empirical equation for the thermal cycling failure of flip-chip Sn-Pb solder joints were determined. The results show that underfill The plastic strain range of flip-chip Sn-Pb solder joints is obviously smaller than that of bottom-fill, and the thermal cycle life can be increased by about 20 times. The influence of the height of solder joints after filling on reliability is not obvious