最近在引线上流体(FOW)技术方面的进步,包括FOW膏和薄膜,使得封装工程师可以设计更薄的封装,减少制造工艺步骤并降低总的封装成本。为满足当今的应用要求,传统的单芯片IC封装设计,逐渐被更加复杂的多芯片封装方案取代。在产品功能更多、性能更高、成本更低的趋势下,封装工程师使用叠层芯片型芯片尺寸封装(SCSP)或类似的封装形式,在与传统单芯片封装体同样尺寸的前提下,可以提供更高的性能。目前已经发表了很多关于叠层芯片封装 Recent advances in wire-on-wire (FOW) technology, including FOW paste and film, enable packaging engineers to design thinner packages, reduce manufacturing process steps and reduce overall packaging costs. To meet today’s application requirements, traditional single-chip IC package designs have gradually been replaced by more complex multi-chip package solutions. With more functions, higher performance and lower cost, packaging engineers use stacked chip scale package (SCSP) or similar packages, which can be the same size as the traditional single chip package Provide higher performance. A lot has been published on the stacked chip package