论文部分内容阅读
用均匀设计法设计实验方案,采用在超声辐照下的化学沉积法制备了一种新型的Cu/Al_2O_3粉末复合材料,探索了该技术中各种因素对镀铜质量的影响规律,找到了表征这些规律的数学方程及化学镀铜的最佳工艺,化学镀铜的最佳工艺为:化学镀液的组成是CuSO_4·5H_2O 0.104mol、NaOH 0.541mol/L、酒石酸钾钠0.152mol/L、CH_2O(37％)0.158mol/L(镀前现加),镀铜时间20min。
A uniform design method was used to design the experimental scheme. A new type of Cu / Al_2O_3 powder composite was prepared by chemical deposition under ultrasonic irradiation. The influence of various factors on the quality of copper plating was explored and the characterization was found The mathematical equations of these laws and the best process of electroless copper plating, the best electroless copper plating process: the composition of the electroless plating bath is 0.104mol of CuSO 4 · 5H 2 O, 0.541mol / L of NaOH, 0.152mol / L of potassium sodium tartrate, (37%) 0.158mol / L (before plating is added), copper plating time 20min.