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为了优化硅圆片直接键合工艺,利用正交试验法,研究了活化液浓度、活化时间和活化温度3个重要工艺参数对硅圆片表面粗糙度的影响规律.试验以活化后表面的承载率BR(bear ratio)高度为指标评价活化效果.其结果表明:活化液浓度对表面粗糙度影响最大,在试验设定水平内浓度越高粗糙度越低;活化时间越长则表面粗糙度越高,必须避免过长的活化时间;而活化温度则对表面粗糙度影响不大.据此结论优化了硅图片的键合工艺,实现了高质量的圆片键合.
In order to optimize the direct bonding process of silicon wafers, orthogonal test was used to study the effects of activation temperature, activation time and activation temperature on the surface roughness of silicon wafers.Through the experiments, The results showed that the concentration of activating solution had the greatest effect on the surface roughness, the higher the concentration was, the lower the roughness was and the longer the activation time, the more the surface roughness High, it is necessary to avoid too long activation time, while the activation temperature has little effect on the surface roughness.According to the conclusion, the bonding process of the silicon picture is optimized and the high-quality wafer bonding is achieved.