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本文介绍一种正在研制的自动 X 射线定向系统用于双旋转(即 SC 切)石英晶体片切角的精密测量。研制该系统的目的在于研制一种能够测量一般的φ/θ切角的原型机,其精度对于 SC 切在±10弧秒,对于 AT 切为±6秒,而对于其他切型为±30秒(在θ>0的体波零温度系数情况下)。测量速度至少每小时50片。假定这些晶片都被预切到正确定向的大约1/4°以内。经过选择的设计是设计一台在微计算机控制下的激光辅助的劳埃(Laue)衍射仪。采用劳埃法只要求晶片的运动有一个自由度,因而使设计较为灵活、开阔。
This article presents an automated X-ray orientation system under development for the precise measurement of the chamfer angle of double-rotation (ie SC-cut) quartz crystal sheets. The system was developed to develop a prototype capable of measuring a typical φ / θ chamfer with accuracy of ± 10 arcsec for SC, ± 6 second for AT cut and ± 30 seconds for other cuts (In the case of θ> 0 body temperature zero temperature coefficient). Measure the speed at least 50 tablets per hour. It is assumed that these wafers are pre-cut to within about 1/4 ° of the correct orientation. The design of choice was to design a laser-assisted Laue diffractometer under microcomputer control. Lloyd’s method requires only one degree of freedom in the movement of the wafer, thus making the design more flexible and open.