过去通常直接组装到PCB板上的元器件,现在都集成到小型的单一封装基板——模块基板上,所构成的SiP(系统级封装)或RF模块等各种各样的功能模块已经越来越多地应用到电子设备中。模块基板是用于连接半导体器件和PCB板的部件,其尺寸、形状同封装的大小相当。具体来说,模块基板包括BGA基板、SiP及MCM(多芯片模块)基板、TAB(tape-automated bonding)基 Components that used to be assembled directly onto the PCB are now integrated into a small single package substrate, a modular substrate, and various functional modules such as SiP (System in Package) or RF module The more applied to electronic devices. Module substrate is used to connect the semiconductor device and PCB components, the size and shape of the package size. Specifically, the module substrate includes a BGA substrate, a SiP and MCM (multichip module) substrate, a TAB (tape-automated bonding) substrate