论文部分内容阅读
微波器件频率进入太赫兹,输能窗的厚度减小至一百甚至几十微米。常规的介质材料,或者多晶金刚石材料已经难以满足强度和真空密封性能的要求。为此设计并研制出一种新型微/超纳米复合多层金刚石膜。该膜采用微波等离子体化学气相沉积法(MPCVD),通过反应气源和沉积参数的改变,实现在硅衬底上依次原位生长微米尺度和超纳米尺度的金刚石膜。研制的复合多层金刚石膜表面粗糙度Ra<0.5μm,生长面的断裂强度高达1550MPa,是普通多晶金刚石膜的三倍。用该膜封接的输能窗目前已经通过真空密封性测试,将首次应用于太赫兹真空器件。
Microwave device frequency into the terahertz, the thickness of the energy transmission window is reduced to one hundred or even tens of microns. Conventional dielectric materials, or polycrystalline diamond materials, have not met the strength and vacuum sealing performance requirements. To this end, a new micro / nano-composite multi-layer diamond film has been designed and developed. The film uses microwave plasma chemical vapor deposition (MPCVD), through the reaction gas source and deposition parameters change, in order to achieve in situ growth of silicon substrate micron and nano-scale nano-scale diamond film. The developed multi-layer diamond film surface roughness Ra <0.5μm, growth surface breaking strength of up to 1550MPa, is three times the ordinary polycrystalline diamond film. The energy-transmission window sealed with this membrane has now passed the vacuum tightness test and will be used for the first time in terahertz vacuum devices.