温度是影响N型硅单晶补偿度低温霍尔测量的主要因素之一。本文提出了一种对温度标准曲线处理的数学回归分析法,导出了回归方程。由此外推所得的温标曲线优于三点法温标曲线,对此进行了实验验证。采用回归分析温标曲线标定的温度用于霍尔测试,可以提高准确性,减小方法的系统误差。本法尚可推广用于其它理化测试。 Temperature is one of the main factors affecting the low temperature Hall measurement of N-type silicon single crystal compensation. In this paper, we propose a mathematical regression analysis method for temperature standard curve processing, and derive the regression equation. The extrapolation of the resulting temperature scale curve is better than the three-point method of temperature curve, which has been experimentally verified. Regression analysis of temperature scale calibration curve for the Hall test, can improve the accuracy and reduce the systematic error of the method. This law can be promoted for other physical and chemical testing.