论文部分内容阅读
已设计并制造成功了一种小型的热通量传戚器(0.74×0.71×0.14厘米),它可以测量从75到300°K 温度范围内的热传导、交换、辐射或这些形式的任意组合的热量的转换。利用半导体银—锑碲合金获得了近似恒定的250毫伏/(瓦/厘米~2)的高灵敏度。使隔离材料的性能变化与使用温度范围内的半导体的性能变化相匹配,就可获得温度补偿。本文还介绍了关于类似应用的合适材料的选择和比较的数据。
A compact heat flux transmitter (0.74 × 0.71 × 0.14 cm) has been designed and fabricated to measure heat transfer, exchange, radiation, or any combination of these forms over a temperature range of 75 to 300 ° K Heat conversion. A nearly constant 250 mV / (W / cm ~ 2) high sensitivity is obtained with a semiconductor silver-antimony-tellurium alloy. Temperature changes can be achieved by matching the performance changes of the isolation material to changes in the performance of the semiconductor over the operating temperature range. This article also presents data on the selection and comparison of suitable materials for similar applications.