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在陶瓷基片上制作金属化图形,是半导体器件和集成电路封装的重要工序之一。当前,厚膜丝网印刷技术是形成这种图形的主要方法。随着器件的工作频率进入微波领域,以及多层生陶瓷封装技术的采用,对金属化图形的精度,提出了更高的要求。制作幅度100微米左右的精细图形,是急需解决的问题。本文从厚膜集成电路的角度出发,讨论了制作厚膜精细图形的几个关键问题。
Making a metallized pattern on a ceramic substrate is one of the key processes for packaging semiconductor devices and integrated circuits. Currently, thick film screen printing technology is the main method of forming such a pattern. With the operating frequency of the device into the microwave field, as well as the adoption of multi-layer ceramic packaging technology, the precision of the metallized graphics is put forward higher requirements. Making a fine pattern with a width of about 100 microns is an urgent problem to be solved. In this paper, from the point of view of the thick film integrated circuits, several key issues of making thick patterns of thick films are discussed.