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本文阐述了铜基钎料钎焊1Cr18Ni9Ti不锈钢时晶间贯穿的特点。区分了铜基钎科和含硼钎料在贯穿形态和贯穿机理上的本质差异,发现铜基钎料的晶间贯穿与其润湿铺展有联系,并通过紫铜和铜锰钴钎料在不锈钢表面的润湿铺展研究证明,铜基钎料的润湿铺展具有三维空间的模型。富锕的Cu-Mn液相沿基体金属二维钎焊表面晶界沟槽润湿铺展的同时,也沿基体金属内部晶界润湿,从而造成晶间贯穿。通常铜基钎料的晶间贯穿不形成脆性相,因而不会恶化接头性能,但若钎焊过程存在拉应力,则可能产生沿晶断裂破坏。
This paper describes the copper-based brazing brazing 1Cr18Ni9Ti stainless steel through the characteristics of the intergranular. Differentiating the essential differences between copper-based brazing and boron-containing brazing filler material in the penetrating and penetration mechanisms, it was found that the intergranular penetration of the copper-based brazing filler metal is related to its wetting and spreading. Copper and copper-manganese-cobalt solder are used on the stainless steel surface Moisture spreading studies have shown that copper-based solder wetting and spreading has a three-dimensional model. The Cu-Mn-rich liquid phase of Ag-rich actinides along the grain boundary groove wetting and spreading of the two-dimensional soldering of the base metal and also wet along the grain boundary inside the base metal to cause intergranular penetration. Usually copper-based solder intergranular penetration does not form a brittle phase, which will not deteriorate the joint performance, but if there is tensile stress during brazing, it may fracture damage along the crystal.