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回顾1980年代,三维(3D)注塑加工的互连元件(MID)被人们视为电子工业的一大技术突破。人们寄希望于注塑元件的表面具备导电功能,由此可淘汰传统的电路板。在这些不切实际的期望破灭之后,当最新的工艺、材料和技术汇聚,足以满足对导电塑料元件的性能要求时,三维MID部件又作为一项
Recalling the 1980s, three-dimensional (3D) injection molding interconnect (MID) is regarded as a major technological breakthrough in the electronics industry. It is hoped that the surface of the injection molded parts will be electrically conductive, thus eliminating the traditional circuit board. After these unrealistic expectations burst, as the latest technology, materials and technology convergence enough to meet the performance requirements of conductive plastic components, three-dimensional MID components and as a