铜球键合由于其成本低并且还可提供更高的可靠性潜力, 最终将成为一种更加流行的主要工艺。目前现有的少管脚数的封装已有一种从金丝向铜丝转变的倾向,但是其中有一些工艺问题,需要该工艺在先进封装中得到广泛的应用之前得以根本的解决。无论采用何种方法,人们可以期望在先进封装中降低成本将最终成为采用铜球键合的驱动力。 Copper ball bonding, due to its low cost and its potential for higher reliability, will eventually become a more prevalent main process. At present, the existing pin-less packages have a tendency to shift from gold wire to copper wire, but some of these process problems need to be fundamentally solved before the process is widely used in advanced packaging. Either way, one can expect the cost savings in advanced packaging to eventually become the driving force behind copper ball bonding.