环氧树脂复合物主要由环氧树脂、交联固化剂、固化促进剂以及添加剂等组成,它具有许多突出的特性,如较好的热稳定性、绝缘性、粘附性、良好的力学性能、优良的成型工艺性能以及较低的成本等,广泛应用于电子元器件的粘接、封装以及印制线路板制作等领域,进而成为目前最为重要的电子化学材料之一。环氧树脂复合物按照使用领域的不同可以分为环氧塑封料(EMC)、PWBs基体材料、电子元件的粘接材料(导电胶、导热胶、贴片胶)等多种类型。 Epoxy resin compound is mainly composed of epoxy resin, cross-linking curing agent, curing accelerator and additives, it has many outstanding features, such as good thermal stability, insulation, adhesion, good mechanical properties , Good molding process performance and low cost, are widely used in electronic components such as bonding, packaging and printed circuit board manufacturing and other fields, and thus become one of the most important electronic chemical materials. Epoxy resin compounds can be divided into epoxy resin encapsulation materials (EMC), PWBs matrix materials, and adhesive materials for electronic components (conductive adhesives, thermal adhesives, adhesive tapes) according to different application fields.