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为了研究高温下短时间Pd/Ti间的互扩散行为,在Ti表面利用磁控溅射技术沉积了Pd膜层,然后分别对Pd/Ti试样进行500℃/5 h,550℃/5 h,600℃/5 h和700℃/5 h高温处理,用XRD、SEM和EDS研究合金层的相组成、微观组织和元素分布。研究发现:当Pd/Ti试样经500℃/5 h处理后,Pd/Ti之间有极轻微的互扩散发生。当温度升高到550℃时,Pd/Ti间产生了连续的扩散层,随着温度升高,膜层之间的互扩散加剧。并且,当温度升高到700℃时,Pd/Ti之间形成了相图中除Ti3Pd5相和Ti3Pd相以外的其余各化合物相。还分析了Pd/Ti界面扩散反应动力学。结果表明,扩散层厚度的增加经历了一个由界面反应动力学控制到扩散控制的过渡。
In order to study the interdiffusion behavior of Pd / Ti at high temperature for short time, a Pd film was deposited on the Ti surface by magnetron sputtering. Then the Pd / Ti samples were respectively subjected to 500 ℃ / 5h, 550 ℃ / 5h , 600 ℃ / 5 h and 700 ℃ / 5 h. The phase composition, microstructure and elemental distribution of the alloy layer were investigated by XRD, SEM and EDS. The results show that there is a very slight interdiffusion between Pd / Ti when Pd / Ti is treated at 500 ℃ for 5 h. When the temperature is increased to 550 ℃, the continuous diffusion layer is formed between Pd / Ti. As the temperature increases, the mutual diffusion between the layers increases. And, when the temperature was raised to 700 ° C, each of the compound phases other than the Ti3Pd5 phase and the Ti3Pd phase in the phase diagram was formed between Pd / Ti. The kinetics of Pd / Ti interfacial diffusion was also analyzed. The results show that the increase of diffusion layer thickness has undergone a transition from interface reaction kinetics control to diffusion control.