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Polyamide (PA6) and polycarbonate (PC) were prepared by a Brabender mixer ( PLV- 151) at 240℃ with 30 rpm for duration of 8 and 6 minutes respectively. The epoxy resin (E) addition can lead to substantial microstructural changes in the PA6/PC blends. Scanning electron microscope (SEM) was used to observe the mixtures characterized by the domains of clearly segregated homophases and voids between the two polymers. PA6/PC of polyamide 6 and polycarbonate with epoxy resin addition under the composition ratio of 20/80, 20/80/1, 40/60/1 and 40/60, were tested to verify the key role of epoxy in promoting the compatibility of PA6 with PC during blending.
Polyamide (PA6) and polycarbonate (PC) were prepared by a Brabender mixer (PLV-151) at 240 ° C with 30 rpm for duration of 8 and 6 minutes respectively. The epoxy resin (E) addition can lead to substantial microstructural changes in the PA6 / PC blends. Scanning electron microscope (SEM) was used to observe the spectra characterized by the domains of clearly segregated homophases and voids between the two polymers. PA6 / PC of polyamide 6 and polycarbonate with epoxy resin addition under the composition ratio of 20 / 80, 20/80/1, 40/60/1 and 40/60, were tested to verify the key role of epoxy in promoting the compatibility of PA6 with PC during blending.