底板设计历来是一件很困难的事,通常是交给设计小组中最有经验的工程师去完成。然而,随着信号频率的提高,畸变和信号损耗就更难以克服。技术的发展在某种程度上并不是同步的。工程人员渴望利用半导体工艺的新成就。新成就已使高速串行链路得以实现,但仍然难免受到传统的连接器和电路板材料(如FR-4)的局限。由于技术发展未能同步,设计快速可靠底板的工作更显得困难重重。 Backplane design has always been a very difficult task, usually to the design team to the most experienced engineers to complete. However, as the signal frequency increases, distortion and signal loss are more difficult to overcome. The development of technology is not synchronized to some extent. Engineering staff eager to take advantage of the new achievements of semiconductor technology. New achievements have made high-speed serial links possible, but are still bound by the limitations of traditional connector and circuit board materials such as FR-4. Due to technical developments failing to synchronize, designing a fast and reliable backplane is even more difficult.